MOS silicon component manufacturing internship

This one-week training course at AIME provides a comprehensive theoretical and practical approach to the fundamental operations involved in manufacturing silicon integrated circuits in NMOS technology, from receipt of the silicon substrate to packaging of the final component and its electrical characterization. At the same time, physical characterization of the various manufacturing stages is carried out.
The course takes place in a clean room at AIME Toulouse (Atelier Interuniversitaire de Micro-nano-Electronique), CNFM Toulouse center), and calls on heavy equipment.

Wafer oxidation
Etching and diffusion of active zones
Deposition and etching of gate polysilicon
Contact opening
Metallization
Spike testing
Packaging
Electrical characterization