Interconnections and signal integrity

The objectives of this course in terms of skills are:
To raise awareness of the importance of the subject by putting into historical and technological perspective the issues linked to interconnections in electronic systems, today's main bottleneck on the roadmap of Moore's Law.
Skills: Know how to quantify and analyze the impact of interconnections on signal integrity (propagation delays, linear amplitude and phase distortions, reflections due to impedance breaks, reduced impedances, matching, coupling, crosstalk, EMC elements).
Learn some of the best practices in design, experimental methods, theoretical and numerical methods with a view to CAD.
Application in a design office: Introduction to PSPICE, simulated case studies.

Electromagnetism courses L1 and L2. PH101 taught in S5

I General information on interconnections 1 Introduction, technological background 2 Packaging hierarchy. Traditional and new interconnection technologies (integrated optical fibers, carbon nanotubes) 3 Interconnection modeling. Definition of a line. 4 Propagation phenomena. Signal integrity. II Study of propagation phenomena in a simple line. 1 Telegraph equations in time and frequency domains. 2 Analysis of transient impulse responses. 3 Frequency-domain analysis 4 Line modeling for simulation (SPICE...) 5 Case studies. Adaptation strategies. III Coupled lines, EMC. 1 General information. Position of the problem 2 Modeling and equation. Case of two loosely coupled microstrip lines. 3 Simulation models (SPICE, modal decomposition).
IV Design office: introduction to PSPICE. Simulated case studies.

Course handout